Inter-diffusion in electrodeposited metal bilayer films
We propose time-resolved specular neutron reflectivity measurements on Cu/Ag and Cu/Sn bilayers (each deposited on Au in either configuration). Electrochemical and AFM imaging data indicate substantial inter-diffusion of the two components, but cannot provide the dynamics or quantify the spatial profiles of the components. We propose to use specular neutron reflectivity to monitor inter-diffusion of the components in Cu/Ag and Cu/Sn bilayers (in both configurations) and the influence, if any of inter-diffusion involving the Au substrate. Modelling suggests diagnostically distinct evolution of reflectivity profiles for different mechanisms, in the extreme represented by (i) vertical diffusion of under laterally uniform conditions and (ii) rapid vertical transport followed by slow lateral diffusion. The outcomes should contribute to the development of coatings for Cu conductors on printed circuit boards with improved solder wetting characteristics, alleviating solder joint failure.
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HILLMAN A. Robert; Andrew D Ballantyne; BARKER Robert; FERREIRA Virginia; RYDER Karl; SAPSTEAD Rachel and SMITH Emma. (2015). Inter-diffusion in electrodeposited metal bilayer films. Institut Laue-Langevin (ILL) doi:10.5291/ILL-DATA.1-04-95
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